UMongameli waseMelika uJoe Biden uvakashele eSouth Korea kusukela namuhla, kanti indawo yakhe yokuqala izoba yimboni ye-semiconductor yakwaSamsung ePyongyang. IPhini likaSihlalo wakwaSamsung Electronics u-Lee Jae-yong kubikwa ukuthi uzovakashela le mboni, enkulu kunawo wonke emhlabeni.
Igalari yezithombe
U-Lee kulindeleke ukuthi abonise u-Biden ama-chips azayo e-3nm GAA, akhiwe yi-Samsung Foundry division. Ubuchwepheshe be-GAA (Gate All Around) busetshenziswa yile nkampani okokuqala ngqa emlandweni wayo. Phambilini ithe izoqala ukukhiqizwa ngobuningi be-3nm GAA chips ezinyangeni ezimbalwa ezizayo. Lawa ma-chips kuthiwa anikeza ukusebenza okuphezulu okungu-30% kunama-chips angu-5nm kanye nokusetshenziswa kwamandla okufika ku-50%. Kuyaqapheleka futhi ukuthi kunenqubo yokukhiqiza engu-2nm ekuthuthukisweni kwangaphambi kwesikhathi okufanele iqale ngo-2025.
Ungaba nentshisekelo ku
Eminyakeni embalwa edlule, ubuchwepheshe bokukhiqiza ama-chip e-Samsung lusalele ngemuva kwe-TSMC eyimbangi yayo enkulu, kokubili mayelana nesivuno nokusebenza kahle kwamandla. Umdondoshiya waseKorea ulahlekelwe amaklayenti amakhulu njenge Apple a Qualcomm. Ngama-chips e-3nm GAA, ingagcina ibambe noma idlule ama-chips e-TSMC angu-3nm.
