Yize i-Samsung bekungowokuqala ukuqala ukukhiqizwa kwe-3nm ama-chips futhi ezinyangeni ezimbalwa ngaphambi kwe-TSMC, kubonakala sengathi imizamo yakhe kulo mkhakha ayizange ibe yimpumelelo Apple umbono owanele. Umdondoshiya weCupertino kubikwa ukuthi wakhetha i-TSMC esikhundleni somdondoshiya waseKorea ukukhiqiza ama-chips ayo wesikhathi esizayo we-M3 kanye ne-A17 Bionic.
Igalari yezithombe
Ikusasa le-Apple le-M3 ne-A17 Bionic chips lizoba ngokusho kolwazi lwesayithi I-Nikkei Asia ekhiqizwa kusetshenziswa inqubo ye-TSMC ye-N3E (3nm). Apple cishe izogcina i-chipset ye-A17 Bionic yamamodeli we-iPhone anamandla kakhulu ezowethula ngonyaka ozayo, kuyilapho ingasebenzisa i-A16 Bionic chip kwabashibhile.
Ungaba nentshisekelo ku
Yize i-Samsung ingakaze ibe nesibopho sokukhiqiza ama-chips ekhompiyutha we-Apple we-M1 kanye ne-M2, yenza okwangaphambili kwenzeke, futhi ngokusho kwababukeli bemakethe ye-chip, kuyafana nakwakamuva. Yize lawa ma-chips enziwa yi-TSMC, ezinye izakhi zinjalo Apple inikeza ezinye izinkampani, kuhlanganise ne-Samsung. Umdondoshiya waseKorea, ikakhulukazi uphiko lwawo lwe-Samsung Electro-Mechanics, luhlinzeka ngokukhethekile nge-FC-BGA (Flip-Chip Ball Grid Array) yama-chipset e-M1 ne-M2. Lawa ma-substrates ayadingeka ukuze kukhiqizwe ama-processor nama-graphic chips ane-high componetion density.
